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Presentations
AVAILABLE iN tHE ORIGINAL LANGUAGE ONLY
Art of Technology Company Presentation, PDF 4.6MB
Art of Technology High Density Packaging-Seminar, PDF 2.5MB
3-D Moulded Interconnect, PDF 258KB
High Density Packaging in Mixed Signal Applications, PDF 1.7MB
Presented by Dr. Etienne Hirt at 2002 Electronica fair in Munich
High Density Packaging for Medical Applications, PDF 8MB
Presented by Dr. Etienne Hirt at 2004 Medtec fair in Stuttgart
Multi Sensor Wrist Device for Surveillance of Elderly PersonsDeveloped within the FP6 Project EMERGE, PDF 2.4MB
Presented by Dr. Etienne Hirt at 2010 pHealth conference in Berlin
