Fine Engineering Services
Pentium® Multi Chip Module (MCM)
TECHNOLOGY dEMONSTRATOR fOR EC PROJECT EUROPRACTICE

Customer

ETH Zurich, Electronics Laboratory, Switzerland

 

Project

Processor Module including 2nd level cache, DRAM Interface and PCI Host-Bridge in housing smaller than the packaged Pentium® Processor.
Pentium-MCM-Size-Comp

Pentium® MCM

4 x smaller than the packaged Pentium® Processor.

example-r1


Challenges

The main challenge was to develop a technology demonstrator for the EC project EUROPRACTICE to show the potential of HDP technologies.

 

  • Interconnection density
  • Power dissipation

Solutions

An existing Pentium® module chipset with 2nd level cache (9 chips plus SMD components) was used with thin film on silicon in a PSGA.
Pentium-MCM

Pentium® MCM

Processor Module including 2nd level cache, DRAM Interface and PCI Host-Bridge.

example-r1


Benefits

Size reduction to just 25% of the original Pentium® system.

 

Encapsulation of the Host Bus (70 interconnections at 66MHz distributed over the entire module).

 

Motherboard reduced from 8 to 4 layers without further optimisation.