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Art of Technology offers the whole spectrum of tasks of electronics design and development including software and test. Depending on the customers requests Art of Technology can take over exactly the part where additional resources are needed, or a whole system as turn key project.
Studies & System Design
Electronics Development, Design & Layout
Software Design & Development
- Firmware
- Cryptography
- Data Base
System Miniaturization
Production with Partner Companies
Design and Development of Test Stations for Functional Test
Quality Assurance, Quality Control & Review Services
Consulting, Review Service, Second Opinion & Trouble Shooting
Research
Technology Dissemination
Art of Technology offers its customers a broad variety of studies. Concept studies discuss if a project can be realized in the manner planned, often also containing cost an investment estimations.
Technology studies discuss different possibilities of used technologies with the focus on cost, time, size or environmental requirements of a system. Often a system design is started with a first workshop that combines the customer information of an application and the first ideas of Art of Technology. The goal of the workshop is to bring all partners to a same level of understanding of the application and to define the goal application.
A system design contains the system partitioning (HW & HW/SW) it takes into account the technology selection and if needed the miniaturization effort. Based on those decisions the component availability is checked according to available packages, delivery times and available MOQs (minimum order quantities). With a lot of new component packages it is not possible to reach every pin and therefore any network for test purposes. So already in early design phase the test concept is integrated. In this phase also the possible manufacturers are evaluated in order to plan the system according to their rules and regulations. Of course, the laws, further regulations and norms are taken into account in this project stage. If needed electrical simulations and thermomechanical analyses are also executed as well as decision about backwards compatibility and scalability to future platforms. Finalized is a system design with Size/cost estimations, project & production planning
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Electronics Development, Design & Layout
Art of Technology executes the development of digital, analog, RF and power electronics. A close cooperation with the selected manufacturers is held during design and especially layout phase.
Layout tool used is Protel 99SE/DXP producing Gerber or GDSII CAM output
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Software Design & Development
Firmware
Art of Technology designs and develops software for embedded system We Implementation of high-level application specific algorithms of our customers or support its development. SW version control and release management is implicitness.
For PCs Art of Technology develops mainly development related
applications and cross-platform communication such as DLLs.
Cryptography
Cryptography covers not only a secure communication but also ensures that the data transferred is correct and originates from the correct sender. Especially in sensor/actuator systems these are often the most important subject. But also often it is not possible to integrate huge communication and cryptography protocols since the micro controllers do not have enough computational power.
Art of Technology supports you with cryptography especially for micro controller and small embedded systems.
Data Base
Art of Technology develops Research data database, database and applications for production test data including tracing according to medical standards. The tools are Access Database by means of SQL statements for easy migration.
Tools
Languages: C, C++, Assembler and Visual Basic for Applications HW Platforms: currently supporting ARM, M16C, ATMEL AVR, HC12, 8051, PIC, x86
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Art of Technology has a long experience especially in system miniaturization and in HDP technologies( HDP) to support its customers with the appropriate, standard or customized solution.
We are able to find the appropriate manufacturers in terms of technologies and production volumes in or outside our broad manufacturing network.
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What is System Miniaturization
The need and the potential to miniaturize electronic systems has inspired many companies to create new or to miniaturize existing electronic applications. Very often system miniaturization is equated with ASICs. That is only one option. There are many other approaches for system miniaturization and the most appropriate combination shall be selected.
System upgrading
Often a system can be miniaturized by upgrading the system, using new and improved components that combine analog and digital functions. Besides that the area of the electronics, the number of components and board layers are reduced and therefore the system cost in production.
System partitioning
For new electronic applications, system partitioning is important. Partitioning the system into logical and functional blocks sets the base for the further steps repartitioning of electronics and software and technology selection.
Decision criteria are:
Reuse of a system part in multiple applications (e.g. amplifier circuit, communication circuit)
Very high complexity of a small system part (e.g. one component with several hundreds of pins in an
otherwise relaxed system),
Different technologies (e.g. high power and memory)
Security or environmental conditions (e.g. parts that have to be especially encapsulated) and others.
Repartitioning of electronics and software
Another possibility to reduce the size of a system is to use micro controllers, processors, FPGAs to integrate discrete and analog electronics into software running on those ICs.
Technology selection
Last but not least is the selection of the appropriate technology. Based on the analysis above, the size
requirements and the expected production volumes, a whole range of electronics implementation
technologies can be chosen:
SMD (down to 0201, BGAs and CSPs),
HDP (different substrate and assembly technologies)
One or several ASIC (analog, digital or mixed signal).
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Production with Partner Companies
Art of Technology is a fables design house and does not have own manufacturing capabilities. Therefore we established a broad network in Europe and liaisons to Asia and America to supply us with electronics in any needed technology and for every possible volume at highest quality.
We are able to supply our customers with prototypes, volume series and several special processes and certification requirements (ISO13485 medical, ISO/TS 16949 automotive and others).
Art of Technology can plan and accompany the manufacturing process if needed. We select the appropriate manufacturer for any need or setup of production at your manufacturer.
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Design and Development of Test Stations for Functional Test
Art of Technology sets up the test procedures and test plans. We design and develop specific project test equipment in hard and software. In addition we also control of off-the-shelf PC measurement cards and program the automation of test stations on NI LabWindows or Visual C++ basis.
We prepare the data processing and storing (MS Access/MySQL). Test systems from Art of Technology ensure a complete documentation and consistent traceability also with multiple manufacturing locations.
If requested we also execute the installation and training at external sites
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Quality Assurance, Quality Control & Review Services
All processes at Art of Technology are setup according to ISO 9001, ISO13485 (including MDD, AIMD). The design processes are according to GAMP. The flexible and adaptable quality system ensures adequate quality level from first design step till production for commercial, industrial or even medical projects. A consistent quality documentation throughout the whole project including risk analysis and management and technical documentation for CE approval are implicitness. HW/SW based assurance of traceability for components and systems, SW version control and release management and even supplier audits are also available on request.
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Consulting, Review Service, Second Opinion & Trouble Shooting
Art of Technology offers its customers several consulting services. These are small projects to get a second, independent opinion for system design & technology evaluation and decisions. We also execute reviews of designs, layouts, documentation or risk managements.
In addition we offer fast & professional help with troubling projects (technical project management,
manpower, expertise, new ideas ... )
Especially for time critical project and demanding projects that have to be first time right or if an external resource has to be supervised these services can decide on the success of a project.
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Art of Technologys close relationships and co-operation to leading to leading technology institutes and Universities in Europe allow us to offer application specific research mainly for biomedical sensors and signal processing.
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Overview
The Art of Technology AG grew out of the EC project EUROPRACTICE MCM EUROPRACTICE HDP therefore our first ultimate offer has been system miniaturization using HDP/MCM technology (High Density Packaging / Multi Chip Module). Since then the dissemination of these technologies is part of our service portfolio. We basically do this dissemination through miniaturization designs, but we also offer courses and seminars to our customers.
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HDP/MCM technology (High Density Packaging / Multi Chip
Module)
Usually, packaged integrated circuits (ICs) are soldered on printed circuit
boards (PCBs). In this soldering process, known as surface mount device
(SMD) fabrication, the ICs are all placed sequentially on the PCB, then soldered/connected in parallel. Each IC-package bridges the fine pitches of the IC connection pads (down to 75 µm) to the rather coarse pitches on the PCB, where there are several hundred µm between interconnect lines. These packages increase the size and weight of a system.
HDP now uses unpackaged ICs (so-called bare dies) to reduce size and weight. The bare dies are placed onto substrates that have a smaller line pitch (2080 µm) than standard PCBs. Also, the ICs are not soldered, but connected in a different way. With wire bonding, small wires are used to connect every single connection pad from the IC to the substrate. Or by using flip-chip, the IC is turned over, thus the connection pads are pointing towards the substrate. Either small solder balls or conductive gluing make the connection.
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